EV6530-F-00A
5V to 60V, Three-Phase Brushless DC Motor Pre-Driver Evaluation Board
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製品説明
The EV6530-F-00A is an evaluation board for the MP6530GF, a three-phase BLDC motor pre-driver.
It operates from a supply voltage of up to 60V. It is configured to drive 3 half bridges consisting of 6 N-channel Power MOSFETs. The rotor position information is provided by the Hall sensors assembled in the motor and the driving control signals are generated by the external controller, such as MCU, FPGA, etc.
製品の特長
- Wide 5V to 60V Input Voltage Range
- Programmable OCP Threshold
- Support 100% Duty Cycle Operation
- OCP, OTP
- Fault Indication Output
パラメータ
60V 3-Phase BLDC Motor Pre-Driver
The MP6530 is a gate driver IC designed for three-phase brushless DC motor driver applications. It is capable of driving three half bridges consisting of 6 N-channel power MOSFETs up to 60V.
The MP6530 uses a bootstrap capacitor to generate a supply voltage for the high-side MOSFET driver. An internal trickle-charge circuit maintains sufficient gate driver voltage at 100% duty cycle.
Internal safety features include programmable over-current protection, adjustable dead-time control, UVLO, and thermal shutdown.
The MP6530 is available in 28-pin, 9.7mm×6.4mm TSSOP-EP and 4mmx4mm QFN-28 package with an exposed thermal pad on the back.
5V to 35V, Three-Phase, Brushless DC Motor Pre-Driver
The MP6529 is a gate driver IC designed for three-phase, brushless DC motor driver applications; it is capable of driving three half-bridges consisting of six N-channel power MOSFETs up to 35V. The MP6529 uses a bootstrap capacitor to generate a supply voltage for the high-side MOSFET driver. An internal trickle-charge circuit maintains a sufficient gate driver voltage at 100% duty cycle. Full protection features include programmable over-current protection (OCP), adjustable dead-time control, under-voltage lockout (UVLO), and thermal shutdown. The MP6529 is available in a 28-pin TSSOP (9.7mmx6.4mm) package with an exposed thermal pad and a 28-contact QFN (4mmx4mm) package with an exposed thermal pad.
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