Innovative Architecture Improves Thermal Performance

This presentation introduces a novel voltage regulator module (VRM) design with enhanced thermal performance. The VRM utilizes 3-dimensional architecture with an inductor sitting on top of the IC. The inductor is designed with a metal band wrap, and the contact between the IC and inductor metal band is implemented using a thermal interface material (TIM) with high thermal conductivity. This allows the metal band to act as a heatsink to dissipate heat from the IC, which significantly improves thermal performance compared to traditional VRMs with 3D architecture.

Review Presentation