Highest Power Density Module
As AI processors require increasing power, traditional lateral power delivery is no longer viable for many designs due to PDN power losses and transient performance impact. To address this, a Z-axis Power Delivery™ (ZPD™) architecture has been implemented, but it poses challenges in fitting and cooling voltage regulator modules (VRMs).
Our latest innovation, MPC24380, tackles these issues by integrating output caps within the module allowing for more VRMs and using a thermally efficient DrMOS-on-top approach with extremely low ThetaJT for easier heat transfer.
As a thought leader in the industry, we're proud to be the first to offer cutting-edge solutions like MPC24380, enabling our clients to go-to-market quicker and stand out from the competition.
Powering Each Generation of AI Hardware
Delivering Innovation
9mm x 10mm x 5mm- Simplified, Innovative Packaging
- Fastest Design Iterations
- Delivered Tens of Millions of AI Modules
- Exceeded Quality Requirements
Front View
Stacked Components
Optimal Power & Thermals
Side View
Integrated Output Caps
All AI Hardware Solutions
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